Bonding material
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United States of America Patent
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Oct 28, 2014
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app pub date -
Sep 7, 2010
filing date -
Jul 2, 2010
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Abstract
Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi2O3-based glass frit powder having an average particle diameter of 200 μm or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking.
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