Semiconductor device and method of manufacturing semiconductor device

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United States of America Patent

PATENT NO 8872263
SERIAL NO

13366966

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Abstract

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The semiconductor device according to the present invention includes: a semiconductor layer of a first conductivity type made of SiC having an Si surface; a gate trench dug down from the surface of the semiconductor layer; a gate insulating film formed on a bottom surface and a side surface of the gate trench so that the ratio of the thickness of a portion located on the bottom surface to the thickness of a portion located on the side surface is 0.3 to 1.0; and a gate electrode embedded in the gate trench through the gate insulating film.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 6158585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Ryota Kyoto, JP 125 529
Nakano, Yuki Kyoto, JP 334 1767

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