Embedded heat pipe in a hybrid cooling system
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United States of America Patent
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Oct 28, 2014
Grant Date -
Jan 1, 2009
app pub date -
Sep 11, 2008
filing date -
Dec 5, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.
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