Method for extracting contour of pattern on photo mask, contour extraction apparatus, method for guaranteeing photo mask, and method for manufacturing semiconductor device

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United States of America Patent

PATENT NO 8873830
SERIAL NO

13427206

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Abstract

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According to one embodiment, a method includes acquiring information about a two-dimensional distribution of secondary electron intensity for a measurement target pattern, extracting, by a first method, an edge position of an edge for correction value acquisition, extracting, by a second method, an edge position of the edge for correction value acquisition, acquiring a difference between the edge positions extracted by the first and second methods, as a correction value, extracting, by the second method, an edge position of a desired edge based on the information about the two-dimensional distribution, and correcting the edge position of the desired edge based on the correction value.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamanaka, Eiji Tokyo, JP 47 292

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