Optical communication module and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8876414
APP PUB NO 20130121652A1
SERIAL NO

13673225

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An optical device board 2 is set to be a printed circuit board in which an optical device 6 is bonded into a predetermined position of a printed wiring board 5. The optical device board 2 is bonded to a base board 3 provided with a plurality of wiring terminals 7. A lens barrel 4 is bonded to the optical device board 2. The optical device 6 is bonded into a position calculated from an actual measured dimension of the printed wiring board 5, and the calculated position is held and positioning is carried out in such a manner that a central axis of the lens barrel 4 is coincident with the calculated position when the lens barrel 4 is to be bonded to the optical device board 2.

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Patent Owner(s)

Patent OwnerAddress
HONDA TSUSHIN KOGYO CO LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miki, Yuushi Tokyo, JP 1 10
Oi, Shigehiro Tokyo, JP 4 11
Taniguchi, Teruyuki Tokyo, JP 1 10
Yoshimura, Koichiro Tokyo, JP 3 10

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