Method for the manufacture of double-sided metalized ceramic substrates

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United States of America Patent

PATENT NO 8876996
APP PUB NO 20110303348A1
SERIAL NO

13158190

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Abstract

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The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.

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Patent Owner(s)

Patent OwnerAddress
IXYS SEMICONDUCTOR GMBHD-68623 LAMPERTHEIM

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Knoll, Heiko Marburg, DE 8 37
Spann, Thomas Fürth, DE 20 65
Weidenauer, Werner Lampertheim, DE 2 9

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