Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux
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United States of America Patent
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Nov 4, 2014
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Aug 20, 2010
filing date -
Sep 3, 2009
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Abstract
An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.
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