Conducting heat away from a printed circuit board assembly in an enclosure
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United States of America Patent
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-
Nov 4, 2014
Grant Date -
Nov 8, 2012
app pub date -
May 9, 2012
filing date -
Aug 17, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.
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