Laser die light source module with low inductance

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United States of America Patent

PATENT NO 8882310
SERIAL NO

13709121

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Abstract

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An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

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Patent Owner(s)

  • MICROSOFT TECHNOLOGY LICENSING, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Felzenshtein, Shlomo Nesher, IL 15 246
Mandelboum, David Rakefet, IL 10 91
Pellman, Asaf Beit Yehoshua, IL 18 228
Yahav, Giora Haifa, IL 76 3046

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