Method of manufacturing rigid-flexible printed circuit board
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United States of America Patent
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Nov 11, 2014
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N/A
app pub date -
Feb 20, 2013
filing date -
Feb 24, 2012
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Abstract
The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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