Polyamide resin composition and method for producing polyamide resin composition

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United States of America Patent

PATENT NO 8883885
SERIAL NO

13637453

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Abstract

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Disclosed is a polyamide resin composition comprising 0.01 to 50 parts by mass of cellulose fiber having an average fiber diameter of 10 μm or less in relation to 100 parts by mass of a polyamide resin. Also disclosed is a method for producing the polyamide resin composition, wherein the monomer constituting the polyamide resin is subjected to a polymerization reaction in the presence of the cellulose fiber having an average fiber diameter of 10 μm or less in a water-containing state.

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Patent Owner(s)

  • UNITIKA LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Keisuke Kyoto, JP 115 510
Nakai, Miho Kyoto, JP 10 45

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