Etch depth determination structure

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United States of America Patent

PATENT NO 8884406
SERIAL NO

13231872

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Abstract

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A semiconductor device wafer includes a test structure. The test structure includes a layer of material having an angle-shaped test portion disposed on at least a portion of a surface of the semiconductor wafer. A ruler marking on the surface of the semiconductor wafer proximate the test portion is adapted to facilitate measurement of a change in length of the test portion.

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Patent Owner(s)

  • ALPHA & OMEGA SEMICONDUCTOR, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhalla, Anup Santa Clara, US 323 5714
Li, Tiesheng San Jose, US 65 634
Lou, Yingying Shanghai, CN 6 32
Wang, Yu Fremont, US 1256 7108

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