Method for cutting processing target
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United States of America Patent
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Nov 18, 2014
Issued Date -
N/A
app pub date -
Jul 21, 2010
filing date -
Jul 28, 2009
priority date (Note) -
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Abstract
A rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby a fracture 17 generated in a thickness direction of the object for separation 10A from a molten processed region 13 acting as a start point reaches a front face 1a of the object 1A continuously without substantially changing its direction. Then, after cutting the objects 1A, 10A, the object 10A is removed from the object 1A, so as to yield chips 19.
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