Bending sensor and deformed shape measurement method
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United States of America Patent
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Nov 18, 2014
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N/A
app pub date -
Sep 16, 2010
filing date -
Nov 24, 2009
priority date (Note) -
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Abstract
Provided are a bending sensor that is less dependent on an input speed of a strain and in which a response delay is unlikely to occur, and a deformed shape measurement method using the bending sensor. The bending sensor is configured to include a base material; a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles filled in the matrix resin at a filling rate of 30% by volume or more, and in which three-dimensional conductive paths are formed by contact among the conductive filler particles, and electrical resistance increases as an deformation amount increases; an elastically deformable cover film arranged so as to cover the sensor body; and a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances. In the sensor body, cracks are formed in advance in such a direction that the conductive paths are cut off during a bending deformation.
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