Polymeric edge seal for bonded substrates

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United States of America Patent

PATENT NO 8894800
SERIAL NO

13777376

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farooq, Mutka G Hopewell Junction, US 1 0
Houghton, Thomas F Hopewell Junction, US 9 75
Parbhoo, Nitin Hopewell Junction, US 2 8
Volant, Richard P Hopewell Junction, US 94 1705

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