Polyamide resin composition and molded product

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United States of America Patent

PATENT NO 8895122
SERIAL NO

13376737

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Abstract

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Disclosed is an m-xylene group-containing polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing 30% by mole or more of an m-xylylenediamine unit and a dicarboxylic acid unit and (B) an aromatic secondary amine based compound and has an oxygen permeability coefficient of not more than 1 cc·mm/m2·day·atm at 23° C. and 75% RH.

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Patent Owner(s)

  • MITSUBISHI GAS CHEMICAL COMPANY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurokawa, Masashi Kanagawa, JP 17 90
Mitadera, Jun Kanagawa, JP 59 242

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