Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
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United States of America Patent
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Nov 25, 2014
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app pub date -
May 7, 2013
filing date -
Nov 22, 2010
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Abstract
The present invention relates to a method of making a semiconductor assembly. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting a semiconductor device into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the semiconductor device and provides signal routing for the semiconductor device. Accordingly, the direct electrical connection between the semiconductor device and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the semiconductor device.
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