Deformable apparatus and method

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United States of America Patent

PATENT NO 8895864
SERIAL NO

13435372

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Abstract

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An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

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Patent Owner(s)

  • NOKIA TECHNOLOGIES OY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andrew, Piers Cambridge, GB 53 1002
Cotton, Darryl St. Ives, GB 39 306
Haque, Samiul Md Chesterton, GB 8 35

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