Printed circuit board structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8895866
APP PUB NO 20140041903A1
SERIAL NO

13741913

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.

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Patent Owner(s)

  • QUANTA COMPUTER INC.;TECH-FRONT (SHANGHAI) COMPUTER CO., LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Steven Songjiang EPZ Shanghai, CN 69 1053
Wu, Jin-Chang New Taipei, TW 7 12
Yang, Mide Songjiang EPZ Shanghai, CN 1 1

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