Semiconductor device bonded by an anisotropic conductive film

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United States of America Patent

PATENT NO 8896117
SERIAL NO

13679113

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Abstract

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A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

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Patent Owner(s)

  • CHEIL INDUSTRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Jang Hyun Uiwang-si, KR 50 94
Kim, Jin Kyu Uiwang-si, KR 69 574
Ko, Youn Jo Uiwang-si, KR 8 25
Lee, Kil Yong Uiwang-si, KR 4 8
Uh, Dong Seon Uiwang-si, KR 45 376

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