Integrated circuit and operation method thereof
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United States of America Patent
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Nov 25, 2014
Grant Date -
May 29, 2014
app pub date -
Mar 15, 2013
filing date -
Nov 29, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit of a multiple die package structure having a plurality of semiconductor devices, each of the plurality of semiconductor devices may include an active termination circuit configured to perform an active termination operation to the semiconductor device, and to be turned off in a disable state of an active termination setting code, a multiple die package information transfer unit configured to transfer a multiple die package information signal, and a compulsory termination unit configured to selectively convert the active termination setting code into the disable state in response to the multiple die package information signal.
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