Cooling in high-density storage systems

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United States of America Patent

PATENT NO 8898682
SERIAL NO

11875556

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Abstract

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In one embodiment an enclosure for a high-density storage system, comprises a backplane to which a plurality of data storage devices may be coupled, a front panel opposite the backplane and defining a first airflow channel adjacent a front side of the data storage devices, a back panel opposite the front panel and comprising a second airflow channel adjacent the backplane, a floor panel and a top panel, a first side panel comprising an array of air flow inlets, a second side panel comprising at least one air flow outlet, and a fan assembly to expel air from the at least one air outlet.

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Patent Owner(s)

  • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bargerhuff, Richard Spring, US 2 8
Giardina, Jeff Cypress, US 1 6
Joshi, Shailesh N Houston, US 177 763

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