Polishing pad having micro-grooves on the pad surface

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United States of America Patent

PATENT NO 8900036
SERIAL NO

13422165

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Abstract

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A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

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Patent Owner(s)

Patent OwnerAddress
FNS TECH CO LTD246 SINGAL-RI JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNG-NAM

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aldeborgh, John Erik Boxford, US 12 77
Hsu, Oscar K Chelmsford, US 17 139
Jin, Marc C Boston, US 11 77
Wells, David Adam Hudson, US 14 110

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