Semiconductor processing system having multiple decoupled plasma sources
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United States of America Patent
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Dec 2, 2014
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app pub date -
May 10, 2011
filing date -
May 10, 2011
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Abstract
A semiconductor substrate processing system includes a substrate support defined to support a substrate in exposure to a processing region. The system also includes a first plasma chamber defined to generate a first plasma and supply reactive constituents of the first plasma to the processing region. The system also includes a second plasma chamber defined to generate a second plasma and supply reactive constituents of the second plasma to the processing region. The first and second plasma chambers are defined to be independently controlled.
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