Welded blister pack for tips

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United States of America Patent

PATENT NO 8900533
SERIAL NO

13538274

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Importance

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Abstract

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A blister package for a plurality of pipette tips comprises a support block with a plurality of molded pockets that extends into the support block from a first wall. The plurality of pockets is configured to receive the plurality of pipette tips. At least one reservoir located within the support block at a distal end of and in fluid communication with at least one of the plurality of pockets. A closure member configured to close the plurality of pockets within the support block.

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Patent Owner(s)

Patent OwnerAddress
MOLECULAR BIOPRODUCTS INC9389 WAPLES STREET SAN DIEGO CA 92121

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cohen, Jesse B San Diego, US 5 70

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