(Meth)acrylic resin composition

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United States of America Patent

PATENT NO 8901192
SERIAL NO

13503546

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Abstract

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Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.

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Patent Owner(s)

  • DENKI KAGAKU KOGYO KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoshino, Takako Shibukawa, JP 6 5
Ichikawa, Isamu Shibukawa, JP 6 51
Kurimura, Hiroyuki Shibukawa, JP 19 115
Nagumo, Takayuki Shibukawa, JP 10 53
Watanabe, Jun Shibukawa, JP 376 3157

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