Integrated circuit package system with window opening

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United States of America Patent

PATENT NO 8901439
SERIAL NO

11465744

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Importance

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Abstract

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An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chin, Chee Keong Butterworth, MY 19 152
Feng, Yu Feng Shanghai, CN 4 11
Shen, Guo Qiang Shanghai, CN 5 27

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