Semiconductor wafer, field-effect transistor, method of producing semiconductor wafer, and method of producing field-effect transistor

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United States of America Patent

PATENT NO 8901656
SERIAL NO

14015775

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Provided is a semiconductor wafer including a base wafer, a first insulating layer, and a semiconductor layer. Here, the base wafer, the first insulating layer and the semiconductor layer are arranged in an order of the base wafer, the first insulating layer and the semiconductor layer, the first insulating layer is made of an amorphous metal oxide or an amorphous metal nitride, the semiconductor layer includes a first crystal layer and a second crystal layer, the first crystal layer and the second crystal layer are arranged in an order of the first crystal layer and the second crystal layer in such a manner that the first crystal layer is positioned closer to the base wafer, and the electron affinity Ea1 of the first crystal layer is larger than the electron affinity Ea2 of the second crystal layer.

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Patent Owner(s)

  • NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY;SUMITOMO CHEMICAL COMPANY, LIMITED;THE UNIVERSITY OF TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Takeshi Tsukuba, JP 256 2618
Fukuhara, Noboru Tsukuba, JP 41 195
Hata, Masahiko Tsukuba, JP 79 579
Kim, SangHyeon Tokyo, JP 35 53
Takagi, Shinichi Tokyo, JP 79 2241
Takenaka, Mitsuru Tokyo, JP 15 90
Yamada, Hisashi Tsukuba, JP 165 1997
Yasuda, Tetsuji Tsukuba, JP 24 105
Yokoyama, Masafumi Tokyo, JP 27 195

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