Semiconductor package with embedded die and its methods of fabrication

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United States of America Patent

PATENT NO 8901724
SERIAL NO

12655335

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Abstract

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Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gonzalez, Javier Soto Chandler, US 15 434
Guzek, John Stephen Chandler, US 1 131
Nalla, Ravi K Chandler, US 29 679
Watts, Nicholas R Phoenix, US 21 457

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