Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus

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United States of America Patent

PATENT NO 8906165
SERIAL NO

13161714

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Importance

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Abstract

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In a substrate processing method according to the present invention, a substrate is first processed using a chemical liquid. Next, the substrate is rinsed by supplying a rinsing liquid thereto while the substrate is being rotated. Thereafter, the substrate is dried while the substrate is being rotated. The drying of the substrate includes reducing a rotating speed of the substrate to a first rotating speed lower than that of the substrate during the rinsing of the substrate, while supplying the rinsing liquid to a central portion of the substrate; moving, from the central portion of the substrate toward a peripheral edge portion thereof, a rinsing liquid supply position to which the rinsing liquid is supplied, after the rotating speed of the substrate has been reduced to the first rotating speed; and supplying a drying liquid to the substrate, after the rinsing liquid supply position has been moved.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawabuchi, Yosuke Koshi, JP 18 66
Maruyama, Hirotaka Koshi, JP 12 67
Minami, Teruomi Koshi, JP 24 235
Okamura, Naoyuki Koshi, JP 11 59

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