Gap embedding composition, method of embedding gap and method of producing semiconductor device by using the composition

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United States of America Patent

PATENT NO 8906253
SERIAL NO

13906027

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Abstract

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A gap embedding composition used for embedding a patterned gap formed between photosensitive resin film portions on a semiconductor substrate surface, the gap embedding composition, at least having: a hydrolysis condensate of an aryloxysilane raw material; and an aromatic compound, as a solvent.

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamamoto, Keiji Shizuoka, JP 138 1926

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