Multichip electronic packages and methods of manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8906809
SERIAL NO

13491174

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.

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First Claim

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beaumier, Martin M Quebec, CA 2 9
Ostrander, Steven P Hopewell Junction, US 38 292
Sikka, Kamal K Hopewell Junction, US 94 730
Toy, Hilton T Hopewell Junction, US 87 1464
Zitz, Jeffrey A Hopewell Junction, US 53 606

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