System comprising a semiconductor device and structure

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United States of America Patent

PATENT NO 8907442
SERIAL NO

13492382

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Abstract

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A semiconductor device, including: a first layer including first transistors; an interconnection layer overlying the first transistors, the interconnection layer providing interconnection for the first transistors; a bonding layer overlying the interconnection layer; a second layer overlying the bonding layer; and a carrier substrate for the transferring of the second layer, where the second layer includes at least one through second layer via, where the at least one through second layer via has a diameter of less than 100 nm, where the second layer includes a plurality of second transistors, and where the second layer is transferred from a donor wafer.

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Patent Owner(s)

  • MONOLTHIC 3D INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beinglass, Israel Sunnyvale, US 60 2993
Cronquist, Brian San Jose, US 284 3809
de, Jong Jan Lodewijk Cupertino, US 21 677
Or-Bach, Zvi San Jose, US 534 17764
Sekar, Deepak C San Jose, US 220 3440
Wurman, Zeev Palo Alto, US 43 557

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