Additives for grain fragmentation in Pb-free Sn-based solder

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United States of America Patent

PATENT NO 8910853
SERIAL NO

13932070

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Abstract

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In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arvin, Charles L Poughkeepsie, US 153 714
Blander, Alexandre Montreal, CA 7 35
Brofman, Peter J Hopewell Junction, US 32 717
Henderson, Donald W Ithaca, US 29 344
Hougham, Gareth G Ossining, US 64 486
Liu, Hsichang Fishkill, US 23 217
Perfecto, Eric D Poughkeepsie, US 46 843
Reddy, Srinivasa SN Bangalore, IN 10 132
Semkow, Krystyna W Poughquag, US 51 602
Srivastava, Kamalesh K Wappingers Falls, US 40 736
Sundlof, Brian R Verbank, US 40 250
Sylvestre, Julien Chambly, CA 29 160
Weisman, Renee L Poughkeepsie, US 16 136

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