System and method of sealing coil leads during encapsulation
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United States of America Patent
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Dec 16, 2014
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app pub date -
Sep 6, 2011
filing date -
Sep 6, 2011
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Abstract
A method of sealing coil leads during encapsulation by placing a lead of a coil in a tube, such that there remains a gap between the lead and the tube; placing the coil in a mold such that the gap remains open to an environment surrounding the mold; and injecting encapsulation material into the closed mold in a liquid state under pressure, thereby causing the material to flow through the gap toward the environment. Injecting encapsulation material into the mold may be done at a rate, temperature, and/or environmental temperature to cause the material to solidify before passing through the gap into the environment. In any case, there is no need to seal the mold to the leads. Each lead of the coil may be placed into an individual tube and/or the tubes may be is formed within a single sleeve.
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