Three dimensional flip chip system and method
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United States of America Patent
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Dec 16, 2014
Issued Date -
N/A
app pub date -
Jun 12, 2012
filing date -
Jun 12, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture.
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