Resin composition

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United States of America Patent

PATENT NO 8912279
SERIAL NO

14087113

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Abstract

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Resin compositions which contain an epoxy resin, an alkoxy oligomer, and an inorganic filler provide insulating layers that have a surface with not only low arithmetic mean roughness but also low root mean square roughness in a wet roughening step and that are capable of forming thereon a plated conductive layer having a sufficient peel strength that can be formed while maintaining the glass transition temperature and thermal expansion coefficient.

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Patent Owner(s)

  • AJINOMOTO CO., INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Shigeo Kawasaki, JP 172 1719
Tsurui, Kazuhiko Kawasaki, JP 3 18
Yoda, Masanori Kawasaki, JP 2 14

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