Defect removal process
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United States of America Patent
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Dec 16, 2014
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app pub date -
Mar 4, 2013
filing date -
Mar 4, 2013
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Abstract
A process is provided for the removal of defects, for example, micro-bridging defects during device fabrication. In one aspect, a method includes: obtaining a wafer after lithography processing and exposing the wafer to at least one electron beam. In another aspect, a system includes: selecting a substrate with micro-bridging defects after the substrate undergoes lithography processing; preparing the substrate for exposure to at least one electron beam; and exposing the substrate to the at least one electron beam.
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