Integrated circuit including thermal gate, related method and design structure

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United States of America Patent

PATENT NO 8912630
SERIAL NO

13444647

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Abstract

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An integrated circuit (IC) and a method of making the same. In one embodiment, the IC includes: a substrate; an insulation layer over the substrate; a resistor over the insulation layer; a thermal gate over the resistor; and a heat sink connected to the thermal gate via a substrate contact, the heat sink adapted to receive thermal energy from the resistor via the thermal gate.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rankin, Jed H Richmond, US 208 4551
Robison, Robert R Colchester, US 96 655
Slisher, Dustin K Wappingers Falls, US 10 78

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