Cavities containing multi-wiring structures and devices
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United States of America Patent
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Dec 23, 2014
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N/A
app pub date -
Nov 15, 2011
filing date -
Nov 15, 2011
priority date (Note) -
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Abstract
An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.
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