Correlation of device manufacturing defect data with device electrical test data
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United States of America Patent
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Dec 23, 2014
Grant Date -
Apr 24, 2014
app pub date -
Sep 12, 2013
filing date -
Sep 27, 2010
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Abstract
Various embodiments related to correlating a location of a defect on a substrate for a semiconductor device to an electrical significance of a device structure at that location are disclosed. For example, one embodiment includes receiving a defect location for the location on the substrate where the defect was detected; receiving a physical representation of the semiconductor device for the defect location; generating a significance determination indicating whether the defect is located in an electrically significant region by correlating the defect location to logical and physical layout information included in the physical representation; and displaying the significance determination.
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