Post metal chemical-mechanical planarization cleaning process

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United States of America Patent

PATENT NO 8920567
APP PUB NO 20140256133A1
SERIAL NO

13786970

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Abstract

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A post metal chemical-mechanical planarization (CMP) cleaning process for advanced interconnect technology is provided. The process, which follows CMP, combines an acidic clean and a basic clean in sequence. The process can achieve a more than 60% reduction in CMP defects, such as polish residues, foreign materials, slurry abrasives, scratches, and hollow metal, relative to an all-basic clean process. The process also eliminates the circular ring defects that occur intermittently during roller brush cleans within a roller brush clean module.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Devarapalli, Vamsi Wappingers Falls, US 1 7
Goyette, Colin J Red Hook, US 1 7
Kennett, Michael R Poughkeepsie, US 1 7
Khojasteh, Mahmoud Poughkeepsie, US 40 277
Lin, Qinghuang Yorktown Heights, US 151 2188
Steffes, James J Poughkeepsie, US 6 163
Ticknor, Adam D Wappingers Falls, US 11 142
Tseng, Wei-tsu Hopewell Junction, US 32 326

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