Semiconductor chip and semiconductor device including the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8922053
APP PUB NO 20120112540A1
SERIAL NO

13278755

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Abstract

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A semiconductor chip includes: a data output buffer that outputs a data signal; a first power-supply pad that supplies a first power-supply potential to the data output buffer; a power-supply wiring that is connected to the first power-supply pad; a strobe output buffer that outputs a strobe signal; and a second power-supply pad that supplies a second power-supply potential to the strobe output buffer. The power-supply wiring and the second power-supply pad are electrically independent of each other. Therefore, the power-supply noise associated with the switching of the data output buffer does not spread to the strobe output buffer. Thus, it is possible to improve the quality of the strobe signal.

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Patent Owner(s)

  • LONGITUDE SEMICONDUCTOR S.A.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujisawa, Hiroki Tokyo, JP 173 2521
Takeda, Hiromasa Tokyo, JP 22 100

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