Package-on-package process for applying molding compound

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United States of America Patent

PATENT NO 8927391
SERIAL NO

13118108

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Abstract

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A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsin-Chu, TW 72 1278
Jang, Bor-Ping Chu-Bei, TW 44 948
Lin, Chih-Wei Xinfeng Township, TW 359 5145
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Hsiu-Jen Zhubei, TW 172 1408
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Lu, Wen-Hsiung Jhonghe, TW 127 2473
Tsai, Yu-Peng Taipei, TW 43 1203
Wu, Sheng-Yu Hsin-Chu, TW 57 433

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