System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme

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United States of America Patent

PATENT NO 8927411
APP PUB NO 20140106559A1
SERIAL NO

14141559

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Felix P Colchester, US 20 193
Daubenspeck, Timothy H Colchester, US 147 1759
Gambino, Jeffrey P Westford, US 531 7344
Hayes, Timothy S Colchester, US 8 31
Letourneau, Donald R Winooski, US 5 18
McDevitt, Thomas L Underhill, US 61 904
Stamper, Anthony K Williston, US 613 6580

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