Interconnect structures and methods of manufacturing of interconnect structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 6, 2015
Grant Date -
Sep 19, 2013
app pub date -
May 3, 2013
filing date -
Feb 21, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The method further includes completely filling in the structure with additional metal.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully