Overburden removal for pore fill integration approach
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United States of America Patent
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Jan 6, 2015
Grant Date -
Jan 17, 2013
app pub date -
Jul 12, 2011
filing date -
Jul 12, 2011
priority date (Note) -
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Abstract
In one exemplary embodiment of the invention, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer; after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores, where heating the structure results in residual filling material being left on the surface of the first layer; and after heating the structure, removing the residual filling material by applying a solvent wash.
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