Immersion-cooling of selected electronic component(s) mounted to printed circuit board
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United States of America Patent
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Jan 6, 2015
Grant Date -
Mar 27, 2014
app pub date -
Mar 7, 2013
filing date -
Sep 26, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
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