Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer

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United States of America Patent

PATENT NO 8933161
SERIAL NO

14005692

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Abstract

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Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

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Patent Owner(s)

  • MITSUBISHI CHEMICAL EUROPE GMBH;MITSUBISHI ENGINEERING-PLASTICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishihara, Kentarou Hiratsuka, JP 6 65
Schrauwen, Bernardus Antonius Gerardus Leende, NL 20 183
Sumino, Takahiko Hiratsuka, JP 12 96
Takano, Takahiro Hiratsuka, JP 36 219

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