Apparatus and methods for coplanar printed circuit board interconnect
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United States of America Patent
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Jan 13, 2015
Grant Date -
N/A
app pub date -
May 30, 2012
filing date -
May 30, 2012
priority date (Note) -
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Abstract
In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.
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